Notícia

EngView Systems will hold a meeting with students from the Technical University of Sofia and the University of Chemical Technology and Metallurgy to present its flagship software, the packaging design solution Package Designer Suite. The event will take place on 21 April 2015 at the Technical University.

The students will have the opportunity to acquaint themselves with the latest cutting-edge technologies in the design of packaging and POP/POS displays. EngView’s team will preview the entire set of functionalities that make Package Designer Suite a reliable partner in the field of packaging software. 

ЕngView Systems believes in spreading the knowledge of modern packaging CAD/CAM systems among the young professionals. For more than 15 years the company has been pursuing a policy of donating Package Designer Suite to universities and educational facilities that feature courses in such a design.