EngView Systems Partners with SIES School of Packaging in India
We are happy to share that we’ve recently started working with the SIES School of Packaging in India - another leading educational institution to which we donate our cutting-edge software, EngView Package & Display Designer. By providing students with access to professional packaging design tools, we help them build real-world skills and prepare for successful careers in the packaging industry. For over 25 years, EngView Systems has been providing innovative solutions in the packaging industry. We believe that sharing our expertise and tools with educational institutions is essential for the industry's future. To explore our other educational partnerships, visit here. About SIES School of Packaging Established in 2001, SIES School of Packaging (SIES SOP) is the first private institute in India dedicated to packaging education and training. Set up by SIES Trust and allied industries, the school aims to improve packaging standards across the country and make India a focal point for contemporary developments in packaging Art, Science, Technology, and Engineering. Empowering Students Through Advanced Technology Our collaboration with SIES School of Packaging delivers comprehensive training in structural packaging design software for two key academic programs: Post Graduate Diploma in Packaging Science & Technology – a 2-year program Bachelor of Science in Packaging Technology – a 3-year program offered in collaboration with SIES College of Arts, Science & Commerce, Nerul Currently, the training focuses on box designing and prototyping, with plans to expand into display design in the near future. The program is led by experienced trainers Mr. Mahesh Choudhury, Dr. Vivek Parab, and Prof. Prasad Iyer, who guide students through the practical applications of EngView’s packaging software. EngView's Commitment to Education For over 25 years, EngView Systems has been at the forefront of providing innovative solutions in the packaging industry. We believe that sharing our expertise and resources with educational institutions is essential for the industry's future growth. By providing students with hands-on experience using EngView Package & Display Designer, we are investing in the future of the packaging industry in India and beyond. Looking Ahead As the packaging industry continues to evolve, the need for skilled professionals who can leverage advanced technologies becomes increasingly critical. EngView Systems is dedicated to supporting educational institutions like SIES School of Packaging, building a bridge between academic excellence and industry innovation. To become our educational partner, contact us at info@engview.com.Read MoreEngView CEO Presents at 14th Workflow Symposium at Stuttgart Media University
EngView Systems was proud to participate in the 14th Workflow Symposium, held on November 6, 2025, at Hochschule der Medien (Stuttgart Media University) in cooperation with the CIP4 Organization. Christian Theiss, CEO of EngView GmbH, delivered an engaging presentation that showcased our company's evolution, innovative solutions, and commitment to workflow automation in the packaging industry. About the 14th Workflow Symposium The Workflow Symposium brought together automation professionals from numerous vendors and university professors for a day of knowledge sharing and innovation. Lecture topics focused on workflow automation, Print Industry 4.0/Digital Smart Factory, and strategies for making print production and planning more profitable. The event was professionally hosted by Stuttgart Media University and conducted in German, creating an ideal environment for meaningful exchanges about the latest developments in workflow automation. The symposium continues to be a premier gathering place for industry professionals seeking to stay at the forefront of technological advancement. EngView Packaging Suite: Presentation During his presentation, Christian Theiss shared the history of EngView as part of the Sirma Holding Group. With over 300 IT professionals, 33+ years of experience, and more than 1,000 projects delivered, Sirma is one of the largest and most successful technology holding groups in the region. The session included a live demonstration of our innovative CAD software, EngView Package & Display Designer, showing attendees the capabilities that make our solution a leading packaging design software worldwide. A major focus was our advanced web services and integration capabilities. Through our comprehensive API, users can now integrate our powerful parametric design technology directly into web-to-print platforms. The benefits are significant: access to 2,500+ ready-to-use designs, the ability to add custom-made parametric designs to your website, 3D visualization for your customers, improved user experience and flexible workflow design that contributes to faster order processing. See how one of our partners, BoostYourBox, is using this technology. A highlight of the presentation was the opportunity for attendees to explore our innovative Augmented Reality feature, which brought packaging designs to life and showed the future of visualization technology in the packaging industry. About the 14th Workflow Symposium The Workflow Symposium brought together automation professionals and university professors for a day of knowledge sharing and innovation. Lecture topics focused on workflow automation, Print Industry 4.0/Digital Smart Factory, and strategies for making print production and planning more profitable. The event was professionally hosted by Stuttgart Media University and conducted in German, creating an ideal environment for meaningful exchanges about the latest developments in workflow automation. The symposium continues to be a gathering place for industry professionals seeking to stay at the forefront of technological advancement. Looking Forward We extend our sincere thanks to the organizers at Stuttgart Media University and the CIP4 Organization, as well as all presenters and participants who made this event a remarkable success. The enthusiastic response to our presentation and the engaging discussions that followed reinforced our commitment to innovation and collaboration within the industry.Read MoreMeet EngView at Booth #1929 during PRINTING United 2025 in Orlando, Florida
EngView is excited to exhibit at PRINTING United Expo 2025, North America's leading event for the print and packaging industry. Taking place October 22-24 in Orlando, Florida, this year's expo will bring together thousands of industry professionals, innovative technologies, and leading companies from across the globe. Come visit us at Booth #1929 where our US team - Kris and Jayce Hanchette - will demonstrate how our packaging design software helps companies create, visualize, and produce packaging faster and smarter. Register for Free Entry Visitors can generate their free expo ticket from the official website using promotional code 700491 to join us in Orlando. What visitors can expect to see at EngView Booth #1929 Our team will present live demonstrations featuring: Wine Bottle and PVC Packaging Designs created with our software Augmented Reality Visualization and 3D modeling capabilities Graphic application through our integration with Adobe Illustrator Extensive Design Library with access to over 2,500 resizable packaging templates Find Our F1 Cars Across the Expo Look for EngView's distinctive Formula 1 racing cars displayed at our partner booths throughout the exhibition floor: Colex Finishing Solutions – Booth #1525 Cutworx – Booth #848 Ronik – Booth #3026 Mimaki USA – Booths #1255 & #1555 Vanguard Digital Printing Systems - Booth #3126 EngView – Booth #1929 Whether you're looking to optimize your design workflow, explore cutting-edge packaging technologies, or network with industry peers, we'd love to meet you. Our team is eager to connect with professionals, share insights, and discuss the future of packaging and print innovation. We look forward to seeing you in Orlando and demonstrating how EngView can transform your packaging design process.Read MoreEngView Releases Compatibility Update for Adobe Illustrator 29.8.2
EngView Package & Display Design has a new compatibility update helping designers use the integration with the latest version of Adobe Illustrator - 29.8.2. Understanding the problem EngView team identified a significant compatibility problem with the new version of Adobe Illustrator 29.8.2. When users saved .ai files with the EngView plug-in, all structural design information and 3D visualization data were lost. This meant that EngView's 3D visualization features could not be preserved in the newest version of Illustrator. Users could still use Adobe Illustrator 29.7.1 or older for the integration. Rapid Response and Resolution Upon discovering the issue, EngView Systems immediately notified customers and provided temporary workarounds while the development team worked on a permanent solution. Users were advised to save files as PDF or EPS format to maintain 3D functionality, or to remain on Adobe Illustrator version 29.7.1 until the fix was available. Update Now Available The newly released update fully restores compatibility with Adobe Illustrator 29.8.2. All EngView plug-in features now function seamlessly with the latest version of Adobe Illustrator, and structural design information and 3D visualization data are properly preserved when saving .ai files. Users can download the update from the EngView Systems website – Downloads page. The update is for both Mac and PC platforms. Lessons and Best Practices EngView Systems recommends that users check the System Requirements and compatibility documents available on the support page before updating Adobe Illustrator in the future. These resources are updated regularly to reflect the latest tested versions and help users avoid potential compatibility issues.Read More